Products

IKALLOY™ – Lead Free RMA Soldering Paste

Solder Composition

LFSMD SnZnMn Alloy is designed as a lead free alternative for SnPb alloys for electronics assemblies operations. The LFSMD SnZnMn alloy conforms and exceeds the impurities requirements of J-STD-006 standard.

Sn	Zn	Mn	Pb	Sb	Fe	Cd
Bal	8.6-8.9	0.01 Max	0.002 Max	0.014 Max	0.012 Max	-

Physical Properties

Melting Point ºC	199
Tensile Strength Mpa	65
Total Elongation %	45
Density g/cc	7.4
Electrical Conductivity % IACS	15

Particle Size

IKALLOY is available in Type 3 (25-45 μm) according to J-STD-005 powder distribution.

Metal loading

Typical metal loading for stencil printing application is 88-88.5%

Organic Part

LFSMD has developed a unique flux system designed specifically for SnZnMn lead free alloy. It provides fluxing activity levels that promote thermal stability and prevents thermal degradation when reflowing under air atmosphere.

Recommended Reflow profile

STAGE	Peak Temperature oC	Rate (oC/sec)	Time (sec)
Pre Heating	150-155	2.0 - 2.5	55 – 60
Soaking	170 – 183	0.3 – 0.5	175-185
Reflow Zone	228 – 232	2.0 – 2.5	45 – 90
Cool Down	50 – 60	3.0 – 6.0	50 - 60

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Data Sheet