Lead Free Soldering Materials Development
Tel: +972- 4 - 821- 2059
Email : info@leadfreesmd.com
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We believe that when the data on the performance and application experience will be gathered, the Tin-Zinc system will become the new solder standard for the electronics industry.

The vast use of electronic devices and their short life span have caused great concern to governments and environmentalists because millions of solder joints containing 37% lead are being disposed every year.

The European Union RoHS Directive (Restriction of Hazardous Substances in Waste of Electrical and Electronic Equipment establishes that after July 1, 2006, all equipment sold in Europe must be Lead free.

Since 1999, LFSMD has worked on the development of a new lead free allow adopting a new approach based on the Tin-Zinc eutectic alloy modified by a proprietary process of microalloying.

By adding a very small quantity of Manganese to Tin-Zinc, the alloy was substantially improved, causing a modification of the surface properties and leading to better wetting, control of oxidation and growth of intermetallic layer at the soldered joint.

IKALLOY™ composition has been patented in the USA and in Israel. The polymeric flux used with IKALLOY is proprietary to LFSMD.

The most widely accepted lead free solder is an alloy composed of tin, silver and copper. It has a relatively high melting point of approx. 220°C, requiring a drastic overhaul of both equipment and processing systems. Furthermore, due to the higher processing temperature required, imposes a significant thermal load during assembly, leads to the use of components having high thermal resistance. In addition, the alloy includes silver, which makes it costly.

The IKALLOY™ melting temperature, at 199°C, is much closer to the conventional leaded solders. Its adoption does not entail a significant change to existing soldering processes, and the required heat tolerance of the components used is similar to that of conventional soldering processes. The use of Tin and Zinc - all widely available materials-makes the new solder a cost effective alternative.

  • Low melting point – 199C
  • Low cost
  • Good wettability
  • Acceptable oxidation
  • Better thermal cycling
  • No changes to production lines